Cleaning a plenum after porting ?? Looking for some ideas !

[Mystic ZR-1]

Originally Posted by mike100

pressure washed with simple green outdoors and then a final steam clean in the dishwasher to melt out any oil and aluminum bits I couldn't reach.

Does the Bride know?

[XfireZ51]

Make sure you test the integrity of the plenum runner walls. Not sure how far you ported it but you'd be surprised where it gets thin, especially short side radius. I ported mine to 36.5mm and we found some extremely thin (paper thin) walls which gave way once I did media blasting of plenum.

[secondchance]

Originally Posted by 5ABI VT

I didn't want to make another post but.. Any reccomendations on thermal paste for the bottom of the plenum ? If I remember right.. CPU paste ?

Go to a Radio Shack and ask for a tube of heat sink compound/paste.

[5ABI VT]

Originally Posted by XfireZ51

Make sure you test the integrity of the plenum runner walls. Not sure how far you ported it but you'd be surprised where it gets thin, especially short side radius. I ported mine to 36.5mm and we found some extremely thin (paper thin) walls which gave way once I did media blasting of plenum.

I'll double check I did feel through them but I wasn't paying too much attention. For peace of mind I'll take another look.

Originally Posted by secondchance

Go to a Radio Shack and ask for a tube of heat sink compound/paste.

I think we still have radio shack in canada ? I can't recall if they're all 'the source ' now.

I have thermal compound for CPU heat sinks. Yay or nay?

[Paul Workman]

Heat sink compound is required, so CPU paste should do the trick,

Two things:

THINNER IS BETTER: Just enough to fill the microscopic grooves left over from when the surfaces were fly-cut is all that should be used. Adding more actually increases the insulation between the heat sink and the "device" to be cooled. If the layer is so thin as to be practically translucent, that is good. No gaps, but NO MORE.

ABSOLUTELY CLEAN: Be careful that the surfaces are free on any foreign debris, e.g., chips or (especially) sand/grit, etc.

Good luck.

[5ABI VT]

Originally Posted by Paul Workman

Heat sink compound is required, so CPU paste should do the trick,

Two things:

THINNER IS BETTER: Just enough to fill the microscopic grooves left over from when the surfaces were fly-cut is all that should be used. Adding more actually increases the insulation between the heat sink and the "device" to be cooled. If the layer is so thin as to be practically translucent, that is good. No gaps, but NO MORE.

ABSOLUTELY CLEAN: Be careful that the surfaces are free on any foreign debris, e.g., chips or (especially) sand/grit, etc.

Good luck.

Thanks ! Im looking it at a cpu/heatsink application point of view. When I removed it.. there was definitely a bit of a layer of paste on there. Ive built a few pcs myself and Ive used the spread method and the pea method before and both pcs are actually still functioning (spread method one is going on 14 years now). Same sort of idea I guess just a larger surface area to cover.