Quote:
Originally Posted by tomtom72
Tyler, the FSM says if you r&r the DIS to use di-electric grease as the heat sink interface. What is the correct grease to use?
I was thinking that the same grease that is used to bed a PC's processor to it's heat sink would be a better choice than di-electric grease?
TIA
Tom |
There was some discussion about this in the past and I think we decided you are correct. We felt the FSM referred to the wrong stuff. What is needed is a substance the conducts heat to the plenum where the incomming air cools the plenum base and indirectly the module.
Tyler